Research output per year
Research output per year
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Dive into the research topics where Hiren Kotadia is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Electromigration aware design for nano-packaging
Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. & Chan, Y. C., 2013, Proceedings of the IEEE Conference on Nanotechnology. p. 24-29 6 p. 6720970Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives
Kotadia, H. R., Panneerselvam, A., Sugden, M. W., Steen, H., Green, M. & Mannan, S. H., Oct 2013, In: Ieee transactions on components packaging and manufacturing technology. 3, 10, p. 1786-1793 8 p., N/A.Research output: Contribution to journal › Article › peer-review
10 Citations (Scopus) -
Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders
Mokhtari, O., Roshanghias, A., Ashayer, R., Kotadia, H. R., Khomamizadeh, F., Kokabi, A. H., Clode, M. P., Miodownik, M. & Mannan, S. H., Jul 2012, In: JOURNAL OF ELECTRONIC MATERIALS. 41, 7, p. 1907-1914 8 p.Research output: Contribution to journal › Article › peer-review
22 Citations (Scopus) -
Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates
Kotadia, H. R., Mokhtari, O., Clode, M. P., Green, M. A. & Mannan, S. H., 15 Jan 2012, In: JOURNAL OF ALLOYS AND COMPOUNDS. 511, 1, p. 176-188 13 p.Research output: Contribution to journal › Article › peer-review
109 Citations (Scopus) -
Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction
Kotadia, H. R., Panneerselvam, A., Mokhtari, O., Green, M. A. & Mannan, S. H., 1 Apr 2012, In: Journal of Applied Physics. 111, 7, p. - 6 p., 074902.Research output: Contribution to journal › Article › peer-review
15 Citations (Scopus)