Research output per year
Research output per year
Personal profile
Research interests
Aluminium technology; high temperature deformation testing, modelling and simulation metals, microstructural and constitutive control of materials processing.
Research interests (short)
Microstructural modelling of materials processing.
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Dive into the research topics where Michael Clode is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
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Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders
Mokhtari, O., Roshanghias, A., Ashayer, R., Kotadia, H. R., Khomamizadeh, F., Kokabi, A. H., Clode, M. P., Miodownik, M. & Mannan, S. H., Jul 2012, In: JOURNAL OF ELECTRONIC MATERIALS. 41, 7, p. 1907-1914 8 p.Research output: Contribution to journal › Article › peer-review
21 Citations (Scopus) -
Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates
Kotadia, H. R., Mokhtari, O., Clode, M. P., Green, M. A. & Mannan, S. H., 15 Jan 2012, In: JOURNAL OF ALLOYS AND COMPOUNDS. 511, 1, p. 176-188 13 p.Research output: Contribution to journal › Article › peer-review
107 Citations (Scopus) -
Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates
Kotadia, H. R., Mokhtari, O., Bottrill, M., Clode, M. P., Green, M. A. & Mannan, S. H., Dec 2010, In: JOURNAL OF ELECTRONIC MATERIALS. 39, 12, p. 2720 - 2731 12 p.Research output: Contribution to journal › Article › peer-review
50 Citations (Scopus) -
Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Milling
Amirmajdi, O. M., Ashyer-Soltani, R., Clode, M. P., Mannan, S. H., Wang, Y., Cabruja, E. & Pellegrini, G., 2009, In: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING. 32, 4, p. 265 - 271 7 p.Research output: Contribution to journal › Article › peer-review
20 Citations (Scopus) -
Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects
Li, J., Mannan, S. H., Clode, M. P., Liu, C., Chen, K., Whalley, D. C., Hutt, D. A. & Conway, P. P., 2008, In: IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 31, 3, p. 574 - 585 12 p.Research output: Contribution to journal › Article › peer-review
6 Citations (Scopus)
Projects
- 7 Finished
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Sintered Nanoparticle Materials - High Temperature Interconnects Beyond Solder
Mannan, S., Clode, M., Green, M., Mesquida, P. & Sajjadi-Emami, S.
1/10/2011 → 30/09/2014
Project: Research
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Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials
Mannan, S., Clode, M. & Green, M.
EPSRC Engineering and Physical Sciences Research Council
1/04/2009 → 30/04/2012
Project: Research
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Microemulsion Fabrication of Nanoparticles for Enhanced Solder Materials
Mannan, S., Clode, M., Miodownik, M. & Sajjadi-Emami, S.
EPSRC Engineering and Physical Sciences Research Council
1/09/2005 → 30/10/2008
Project: Research
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Liquid Solder Interconnects for High Temperature Applications
EPSRC Engineering and Physical Sciences Research Council
1/03/2004 → 20/07/2007
Project: Research
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Liquid phase connections for high temperature electronics: Feasibility Study
EPSRC Engineering and Physical Sciences Research Council
1/03/2002 → 30/11/2002
Project: Research
Activities
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DTI (Aluminium Extrusion) Global Watch mission to Italy
Michael Clode (Member)
2005 → …Activity: Other › Types of External academic engagement - Membership of external research organisation
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the Light Metals Committee (Institute of Materials, Minerals and Mining, IoM3)
Michael Clode (Member)
2002 → …Activity: Other › Types of External academic engagement - Membership of external research organisation
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Subject Area Board in Engineering and Technology (UoL)
Michael Clode (Member)
2001 → …Activity: Other › Types of Business and Community - Work on advisory panel to industry or government or non-government organisation