A review: On the development of low melting temperature Pb-free solders

TY - JOUR

T1 - A review: On the development of low melting temperature Pb-free solders

AU - Kotadia, Hiren R.

AU - Howes, Philip D.

AU - Mannan, Samjid H.

PY - 2014/6

Y1 - 2014/6

N2 - Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and elsewhere having moved to restrict the use of Pb, it is imperative that new Pb-free solders are developed which can meet the long established benchmarks set by leaded solders and improve on the current generation of Pb free solders such as SAC105 and SAC305. Although this poses a great challenge to researchers around the world, significant progress is being made in developing new solder alloys with promising properties. In this review, we discuss fundamental research activity and its focus on the solidification and interfacial reactions of Sn-based solder systems. We first explain the reactions between common base materials, coatings, and metallisatons, and then proceed to more complex systems with additional alloying elements. We also discuss the continued improvement of substrate resistance to attack from molten Sn which will help maintain the interface stability of interconnections. Finally, we discuss the various studies which have looked at employing nanoparticles as solder additives, and the future prospects of this field.

AB - Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and elsewhere having moved to restrict the use of Pb, it is imperative that new Pb-free solders are developed which can meet the long established benchmarks set by leaded solders and improve on the current generation of Pb free solders such as SAC105 and SAC305. Although this poses a great challenge to researchers around the world, significant progress is being made in developing new solder alloys with promising properties. In this review, we discuss fundamental research activity and its focus on the solidification and interfacial reactions of Sn-based solder systems. We first explain the reactions between common base materials, coatings, and metallisatons, and then proceed to more complex systems with additional alloying elements. We also discuss the continued improvement of substrate resistance to attack from molten Sn which will help maintain the interface stability of interconnections. Finally, we discuss the various studies which have looked at employing nanoparticles as solder additives, and the future prospects of this field.

KW - Soldering

KW - Lead-free solder

KW - Intermetallic compounds

KW - Interfacial reactions

KW - Nanocomposite solders

KW - SN-AG-CU

KW - LEAD-FREE SOLDERS

KW - ELECTROLESS NI-P

KW - INTERFACIAL REACTIONS

KW - MECHANICAL-PROPERTIES

KW - INTERMETALLIC COMPOUND

KW - SN-3.5AG SOLDER

KW - COOLING RATE

KW - COMPOSITE SOLDERS

KW - DIFFUSION COUPLES

U2 - 10.1016/j.microrel.2014.02.025

DO - 10.1016/j.microrel.2014.02.025

M3 - Literature review

SN - 0026-2714

VL - 54

SP - 1253

EP - 1273

JO - MICROELECTRONICS RELIABILITY

JF - MICROELECTRONICS RELIABILITY

IS - 6-7

ER -