Bond strengths of three-step etch-and-rinse adhesives to silane contaminated dentin

Vasavat Soontornvatin, Taweesak Prasansuttiporn, Ornnicha Thanatvarakorn, Sumana Jittidecharaks, Keiichi Hosaka, Richard M. Foxton, Masatoshi Nakajima

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


This study aimed to evaluate the effect of silane coupling agent contamination on the microtensile bond strength (μTBS) of 3-step etch-and-rinse adhesives on dentin. Flat occlusal dentin surfaces were prepared and randomly divided into 8 groups (n=20) based on the tested adhesives; Scotchbond Multi-purpose or Optibond FL, with contamination of an experimental silane (2 vol% of 3-m ethacryloxypropyltrimethoxysilane at pH 4.5) before acid-etching, after-etching or after-priming; while the groups without silane contamination served as controls. μTBS data were analyzed by two-way ANOVA and Tukey’s HSD tests at a significance level of 0.05. Additional specimens of contaminated dentin were used to analyze changes in the organic molecules by Fourier transform infrared spectroscopy (FTIR). Silane contamination before acid-etching did not significantly change μTBS (p>0.05), but contamination afteretching and after-priming significantly decreased ^TBS of both adhesives (p<0.05). Silane contamination had an adverse effect on the dentin bond strength of 3-step etch-and-rinse adhesives especially after-priming.

Original languageEnglish
Article numberdmj/2020-025
Pages (from-to)385-392
Number of pages8
JournalDental materials journal
Issue number2
Publication statusPublished - 31 Mar 2021


  • 3-step etch-and-rinse adhesive
  • Ceramic repairing
  • Contamination
  • Microtensile bond strength
  • Silane coupling agent


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