Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders

Omid Mokhtari; Ali Roshanghias; Roya Ashayer; Hiren R. Kotadia; Farzad Khomamizadeh; Amir H. Kokabi; Michael P. Clode; Mark Miodownik; Samjid H. Mannan

doi:10.1007/s11664-012-1976-y

Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders

Omid Mokhtari, Ali Roshanghias, Roya Ashayer, Hiren R. Kotadia, Farzad Khomamizadeh, Amir H. Kokabi, Michael P. Clode, Mark Miodownik, Samjid H. Mannan

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21 Citations (Scopus)

Abstract

The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica nanoparticles in the 100 nm range coated with 2 nm to 3 nm of gold can be dispersed within solders during the normal reflow soldering process, and that these particles are effective in hardening the solder and restricting dynamic grain growth during compression testing at low homologous temperature. As the homologous temperature increases towards 0.75, the effects of the nanoparticles on both mechanical properties and dynamical grain growth reduce, and by homologous temperatures of 0.86 the effects have completely disappeared. This behavior is explained by introducing the concept of an effective volume fraction of pinning nanoparticles, and the practical implications for using nanoparticles to control solder properties via Zener pinning at high homologous temperatures are discussed.

Original language	English
Pages (from-to)	1907-1914
Number of pages	8
Journal	JOURNAL OF ELECTRONIC MATERIALS
Volume	41
Issue number	7
DOIs	https://doi.org/10.1007/s11664-012-1976-y
Publication status	Published - Jul 2012

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title = "Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders",

abstract = "The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica nanoparticles in the 100 nm range coated with 2 nm to 3 nm of gold can be dispersed within solders during the normal reflow soldering process, and that these particles are effective in hardening the solder and restricting dynamic grain growth during compression testing at low homologous temperature. As the homologous temperature increases towards 0.75, the effects of the nanoparticles on both mechanical properties and dynamical grain growth reduce, and by homologous temperatures of 0.86 the effects have completely disappeared. This behavior is explained by introducing the concept of an effective volume fraction of pinning nanoparticles, and the practical implications for using nanoparticles to control solder properties via Zener pinning at high homologous temperatures are discussed.",

author = "Omid Mokhtari and Ali Roshanghias and Roya Ashayer and Kotadia, {Hiren R.} and Farzad Khomamizadeh and Kokabi, {Amir H.} and Clode, {Michael P.} and Mark Miodownik and Mannan, {Samjid H.}",

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T1 - Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders

AU - Mokhtari, Omid

AU - Roshanghias, Ali

AU - Ashayer, Roya

AU - Kotadia, Hiren R.

AU - Khomamizadeh, Farzad

AU - Kokabi, Amir H.

AU - Clode, Michael P.

AU - Miodownik, Mark

AU - Mannan, Samjid H.

PY - 2012/7

Y1 - 2012/7

N2 - The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica nanoparticles in the 100 nm range coated with 2 nm to 3 nm of gold can be dispersed within solders during the normal reflow soldering process, and that these particles are effective in hardening the solder and restricting dynamic grain growth during compression testing at low homologous temperature. As the homologous temperature increases towards 0.75, the effects of the nanoparticles on both mechanical properties and dynamical grain growth reduce, and by homologous temperatures of 0.86 the effects have completely disappeared. This behavior is explained by introducing the concept of an effective volume fraction of pinning nanoparticles, and the practical implications for using nanoparticles to control solder properties via Zener pinning at high homologous temperatures are discussed.

AB - The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica nanoparticles in the 100 nm range coated with 2 nm to 3 nm of gold can be dispersed within solders during the normal reflow soldering process, and that these particles are effective in hardening the solder and restricting dynamic grain growth during compression testing at low homologous temperature. As the homologous temperature increases towards 0.75, the effects of the nanoparticles on both mechanical properties and dynamical grain growth reduce, and by homologous temperatures of 0.86 the effects have completely disappeared. This behavior is explained by introducing the concept of an effective volume fraction of pinning nanoparticles, and the practical implications for using nanoparticles to control solder properties via Zener pinning at high homologous temperatures are discussed.

U2 - 10.1007/s11664-012-1976-y

DO - 10.1007/s11664-012-1976-y

M3 - Article

SN - 0361-5235

VL - 41

SP - 1907

EP - 1914

JO - JOURNAL OF ELECTRONIC MATERIALS

JF - JOURNAL OF ELECTRONIC MATERIALS

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ER -

Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders

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