Electromigration aware design for nano-packaging

X. Zhu, H. Kotadia, S. Xu, H. Lu, S. H. Mannan, C. Bailey, Y. C. Chan

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


The physical phenomenon electromigration (EM) and computer simulation methods of EM in microelectronics devices have been reviewed. A multi-physics EM simulation method which can be used to predict voids appearance in conductors has been described and its relevant challenges have been discussed. The optimizing methods for nano-packaging are discussed in this work and shunt structure for solder joint is proposed and been verified to have a significant potential to

Original languageEnglish
Title of host publicationProceedings of the IEEE Conference on Nanotechnology
Number of pages6
Publication statusPublished - 2013
Event2013 13th IEEE International Conference on Nanotechnology, IEEE-NANO 2013 - Beijing, China
Duration: 5 Aug 20138 Aug 2013


Conference2013 13th IEEE International Conference on Nanotechnology, IEEE-NANO 2013


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