Electromigration aware design for nano-packaging

X. Zhu; H. Kotadia; S. Xu; H. Lu; S. H. Mannan; C. Bailey; Y. C. Chan

doi:10.1109/NANO.2013.6720970

Electromigration aware design for nano-packaging

X. Zhu, H. Kotadia, S. Xu, H. Lu, S. H. Mannan, C. Bailey, Y. C. Chan

Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

The physical phenomenon electromigration (EM) and computer simulation methods of EM in microelectronics devices have been reviewed. A multi-physics EM simulation method which can be used to predict voids appearance in conductors has been described and its relevant challenges have been discussed. The optimizing methods for nano-packaging are discussed in this work and shunt structure for solder joint is proposed and been verified to have a significant potential to

Original language	English
Title of host publication	Proceedings of the IEEE Conference on Nanotechnology
Pages	24-29
Number of pages	6
DOIs	https://doi.org/10.1109/NANO.2013.6720970
Publication status	Published - 2013
Event	2013 13th IEEE International Conference on Nanotechnology, IEEE-NANO 2013 - Beijing, China Duration: 5 Aug 2013 → 8 Aug 2013

Conference

Conference	2013 13th IEEE International Conference on Nanotechnology, IEEE-NANO 2013
Country/Territory	China
City	Beijing
Period	5/08/2013 → 8/08/2013

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10.1109/NANO.2013.6720970

Cite this

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AU - Bailey, C.

AU - Chan, Y. C.

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Electromigration aware design for nano-packaging

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