Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives

Hiren R. Kotadia*, Arunkumar Panneerselvam, Mark W. Sugden, Hector Steen, Mark Green, Samjid H. Mannan

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

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