High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles

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Abstract

By using a novel in situ reduction-sintering process, the native oxide on Cu nanoparticle surface wasremoved and obvious oxide was not found even after sintering in air. Pressureless sintering at 220 °C for 5 min resulted in a high joint shear strength of over 30 MPa. The growth of oxide on Cu nanoparticle
surfaces during storage was studied and the level of oxide film that hinders sintering was also determined. The consolidation behavior of Cu nanoparticles during sintering was observed. The results show that the sintering density of Cu nanoparticles peaked after only 5 min and the formation of dislocations were
observed in the sintered structure after prolonged heating times.
Original languageEnglish
Article number128260
JournalMATERIALS LETTERS
Volume276
DOIs
Publication statusPublished - 1 Oct 2020

Keywords

  • Low-temperature bonding
  • Nanoparticle
  • Oxide growth
  • Reduction sintering

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