Integrated electrode and high density feedthrough system for chip-scale implantable devices

Rylie A. Green*, Thomas Guenther, Christoph Jeschke, Amandine Jaillon, Jin F. Yu, Wolfram F. Dueck, William W. Lim, William C. Henderson, Anne Vanhoestenberghe, Nigel H. Lovell, Gregg J. Suaning

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)

Abstract

High density feedthroughs have been developed which allow for the integration of chip-scale features and electrode arrays with up to 1141 stimulating sites to be located on a single implantable package. This layered technology displays hermetic properties and can be produced from as little as two laminated 200μm thick alumina sheets. It can also be expanded to a greater number of layers to allow flexible routing to integrated electronics. The microelectrodes, which are produced from sintered platinum (Pt) particulate, have high charge injection capacity as a result of a porous surface morphology. Despite their inherent porosity the electrodes are electrically stable following more than 1.8 billion stimulation pulses delivered at clinically relevant levels. The ceramic-Pt constructs are also shown to have acceptable biological properties, causing no cell growth inhibition using standard leachant assays and support neural cell survival and differentiation under both passive conditions and active electrical stimulation.

Original languageEnglish
Pages (from-to)6109-6118
Number of pages10
JournalBiomaterials
Volume34
Issue number26
DOIs
Publication statusPublished - Aug 2013

Keywords

  • Alumina
  • Feedthroughs
  • Hermetic
  • High-density array
  • Platinum electrodes

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