Morphological changes in sintered silver due to atomic migration

Research output: Chapter in Book/Report/Conference proceedingChapter

46 Citations (Scopus)
Original languageEnglish
Title of host publicationDie-Attach Materials for High Temperature Applications in Microelectronics Packaging
Subtitle of host publicationMaterials, Processes, Equipment, and Reliability
EditorsKim Siow
PublisherSpringer
ISBN (Electronic)978-3-319-99256-3
ISBN (Print)978-3-319-99255-6
DOIs
Publication statusAccepted/In press - 1 Dec 2018

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