Original language | English |
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Title of host publication | Die-Attach Materials for High Temperature Applications in Microelectronics Packaging |
Subtitle of host publication | Materials, Processes, Equipment, and Reliability |
Editors | Kim Siow |
Publisher | Springer |
ISBN (Electronic) | 978-3-319-99256-3 |
ISBN (Print) | 978-3-319-99255-6 |
DOIs | |
Publication status | Accepted/In press - 1 Dec 2018 |
Morphological changes in sintered silver due to atomic migration
Research output: Chapter in Book/Report/Conference proceeding › Chapter
52
Citations
(Scopus)