New prototype assembly methods for biosensor integrated circuits

TY - JOUR

T1 - New prototype assembly methods for biosensor integrated circuits

AU - Graham, Anthony H. D.

AU - Bowen, Chris R.

AU - Surguy, Susan M.

AU - Robbins, Jon

AU - Taylor, John

PY - 2011/10

Y1 - 2011/10

N2 - Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (

AB - Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (

U2 - 10.1016/j.medengphy.2011.03.006

DO - 10.1016/j.medengphy.2011.03.006

M3 - Article

VL - 33

SP - 973

EP - 979

JO - Medical Engineering and Physics

JF - Medical Engineering and Physics

IS - 8

ER -