Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

Rajkumar Durairaj*, Roya Ashayer, Hiren R. Kotadia, Neil Haria, Chris Lorenz, Omid Mokhtari, Samjid H. Mannan

*Corresponding author for this work

Research output: Contribution to conference typesPaperpeer-review

6 Citations (Scopus)

Abstract

The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5-15 nm range suspended in water and stabilized by a BH4 complex were dropped onto a polished Ag substrate heated to 333 K. The Ag particles sintered to each other and to the substrate to form a largely pore free system. A molecular dynamics simulation is used to understand the theoretical limits of pressure free sintering and practical implications for adhesive systems based on Ag nanoparticle suspensions are discussed.

Original languageEnglish
DOIs
Publication statusPublished - 22 Nov 2012
Event2012 12th IEEE International Conference on Nanotechnology, NANO 2012 - Birmingham, United Kingdom
Duration: 20 Aug 201223 Aug 2012

Conference

Conference2012 12th IEEE International Conference on Nanotechnology, NANO 2012
Country/TerritoryUnited Kingdom
CityBirmingham
Period20/08/201223/08/2012

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