Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

TY - CONF

T1 - Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

AU - Durairaj, Rajkumar

AU - Ashayer, Roya

AU - Kotadia, Hiren R.

AU - Haria, Neil

AU - Lorenz, Chris

AU - Mokhtari, Omid

AU - Mannan, Samjid H.

PY - 2012/11/22

Y1 - 2012/11/22

N2 - The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5-15 nm range suspended in water and stabilized by a BH4 complex were dropped onto a polished Ag substrate heated to 333 K. The Ag particles sintered to each other and to the substrate to form a largely pore free system. A molecular dynamics simulation is used to understand the theoretical limits of pressure free sintering and practical implications for adhesive systems based on Ag nanoparticle suspensions are discussed.

AB - The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5-15 nm range suspended in water and stabilized by a BH4 complex were dropped onto a polished Ag substrate heated to 333 K. The Ag particles sintered to each other and to the substrate to form a largely pore free system. A molecular dynamics simulation is used to understand the theoretical limits of pressure free sintering and practical implications for adhesive systems based on Ag nanoparticle suspensions are discussed.

UR - https://www.scopus.com/pages/publications/84869196811

U2 - 10.1109/NANO.2012.6321890

DO - 10.1109/NANO.2012.6321890

M3 - Paper

AN - SCOPUS:84869196811

T2 - 2012 12th IEEE International Conference on Nanotechnology, NANO 2012

Y2 - 20 August 2012 through 23 August 2012

ER -