Review of silver nanoparticle based die attach materials for high power/temperature applications

Seyed Amir Paknejad*, Samjid H. Mannan

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

187 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Review of silver nanoparticle based die attach materials for high power/temperature applications'. Together they form a unique fingerprint.

Material Science

Engineering