Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants: a comparative long-term ageing study

C. Lamont, T. Grego, K. Nanbakhsh, A. Shah Idil, V Giagka, A. Vanhoestenberghe, S. Cogan, Nick Donaldson

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)
Original languageEnglish
JournalJournal Of Neural Engineering
Volume18
Issue number5
DOIs
Publication statusPublished - Oct 2021

Keywords

  • accelerated tests
  • electrochemical impedance spectroscopy
  • encapsulation
  • impedance spectroscopy
  • integrated circuit
  • life-testing
  • silicone

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