Six dimensional compliance analysis of ortho-planar springs for a continuum manipulator

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4 Citations (Scopus)

Abstract

Ortho-planar spring is a compact spring that generates the motion based on the deformation of flexure elements, and it has wide applications in the compliant robotic designs. Previous studies only investigate the out-of-plane compliance of orthoplanar spring and fewer work pays attention to its angular compliance. To address this issue, this paper provides an analytical method to study both the linear and angular compliance characteristics of ortho-planar spring for the first time. In the frame work of screw theory, the symbolic formula of platform's compliance matrix was obtained based on the hybrid integration of beam elements. Subsequently non-dimensional geometric parameters were introduced to compare the compliance characteristics of planar spring, which revealed the ortho-planar spring also demonstrates large bending compliance. Numerical studies of angular compliance of planar spring were provided, and they showed good agreements with the finite element simulations in a large working range. Based on the numerical study, a physical prototype of one continuum structure assembled with planar springs was provided and it demonstrated a large flexibility compared to other previous designs, which suggests the ortho-planar spring has potential value in developing continuum manipulators in related medical surgery and biorobotic research fields.

Original languageEnglish
Title of host publication38th Mechanisms and Robotics Conference
PublisherAmerican Society of Mechanical Engineers (ASME)
Volume5A
ISBN (Electronic)9780791846360
DOIs
Publication statusPublished - 1 Jan 2014
EventASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2014 - Buffalo, United States
Duration: 17 Aug 201420 Aug 2014

Conference

ConferenceASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2014
Country/TerritoryUnited States
CityBuffalo
Period17/08/201420/08/2014

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