@inbook{192e2eee5c5f46dc9acb9c9c9de49b8d,
title = "The voids growth path on Sn-Ag thin film under high current density",
abstract = "In this study, electromigration (EM) behavior in a SnAg solder thin-film stripe deposited on a glass substrate has been investigated under a current density of 4.4 × 104 A/cm2. A new method run in Matlab, “Random walk” was first put forward to on the simulation of void formation. The findings show that the current density and thermal distribution play important roles for the void formations on the cathode if the thermal gradient in the specimen is completely neglected.",
keywords = "Electromigration, Reliability, thin film",
author = "Zhi Jin and Shen, {Yu An} and Yang Zuo and Mannan, {S. H.} and Hiroshi Nishikawa",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.; 20th International Conference on Electronics Packaging, ICEP 2021 ; Conference date: 12-05-2021 Through 14-05-2021",
year = "2021",
month = may,
day = "12",
doi = "10.23919/ICEP51988.2021.9451933",
language = "English",
series = "2021 International Conference on Electronics Packaging, ICEP 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "115--116",
booktitle = "2021 International Conference on Electronics Packaging, ICEP 2021",
}