Ultra-Stable Sintered Silver Die Attach for Demanding High Power/Temperature Applications

Seyed Amir Paknejad; Khalid Khtatba; Ali Mansourian; Samjid H. Mannan

doi:10.1109/TDMR.2017.2737829

Ultra-Stable Sintered Silver Die Attach for Demanding High Power/Temperature Applications

Seyed Amir Paknejad, Khalid Khtatba, Ali Mansourian, Samjid H. Mannan

Physics

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

315 Downloads (Pure)

Abstract

A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing demand for a reliable material to enable high power/temperature electronics operating above 300 °C. However, it is now a well-known fact that such materials undergo massive microstructural evolution at 250 °C and above, creating doubts about their long-term reliability. Here an additional processing step utilizing oxidizing treatment is demonstrated to immobilize the silver atoms through formation of Ag₂O. This technique stabilizes sintered silver up to 400 °C, taking advantage of the open pore network to facilitate treatment deep in the material interior.

Original language	English
Journal	IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume	PP
Issue number	99
Early online date	9 Aug 2017
DOIs	https://doi.org/10.1109/TDMR.2017.2737829
Publication status	E-pub ahead of print - 9 Aug 2017

Keywords

Aging
Nanotechnology.
Reliability
Semiconductor Device Packaging
Silver

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10.1109/TDMR.2017.2737829

Ultra-Stable Sintered Silver_PAKNEJAD_Firstpublished9August2017_GREEN AAM
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Cite this

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Ultra-Stable Sintered Silver Die Attach for Demanding High Power/Temperature Applications

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