Ultra-Stable Sintered Silver Die Attach for Demanding High Power/Temperature Applications

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Abstract

A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing demand for a reliable material to enable high power/temperature electronics operating above 300 °C. However, it is now a well-known fact that such materials undergo massive microstructural evolution at 250 °C and above, creating doubts about their long-term reliability. Here an additional processing step utilizing oxidizing treatment is demonstrated to immobilize the silver atoms through formation of Ag₂O. This technique stabilizes sintered silver up to 400 °C, taking advantage of the open pore network to facilitate treatment deep in the material interior.

Original languageEnglish
JournalIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
VolumePP
Issue number99
Early online date9 Aug 2017
DOIs
Publication statusE-pub ahead of print - 9 Aug 2017

Keywords

  • Aging
  • Nanotechnology.
  • Reliability
  • Semiconductor Device Packaging
  • Silver

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