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Ultra-Stable Sintered Silver Die Attach for Demanding High Power/Temperature Applications

Research output: Contribution to journalArticle

Original languageEnglish
JournalIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
VolumePP
Issue number99
Early online date9 Aug 2017
DOIs
Accepted/In press7 Aug 2017
E-pub ahead of print9 Aug 2017

Documents

  • Ultra-Stable Sintered Silver_PAKNEJAD_Firstpublished9August2017_GREEN AAM

    08006242.pdf, 1.11 MB, application/pdf

    Uploaded date:08 Sep 2017

    Version:Accepted author manuscript

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King's Authors

Abstract

A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing demand for a reliable material to enable high power/temperature electronics operating above 300 °C. However, it is now a well-known fact that such materials undergo massive microstructural evolution at 250 °C and above, creating doubts about their long-term reliability. Here an additional processing step utilizing oxidizing treatment is demonstrated to immobilize the silver atoms through formation of Ag₂O. This technique stabilizes sintered silver up to 400 °C, taking advantage of the open pore network to facilitate treatment deep in the material interior.

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