Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging

Yang Zuo; Ana Robador; Martin Wickham; Samjid Mannan

doi:10.1016/j.corsci.2022.110713

Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging

Yang Zuo^*, Ana Robador, Martin Wickham, Samjid Mannan

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

Abstract

Sintered Cu interconnection suffers from an oxidation issue in high temperature applications so that understanding the oxidation mechanism is vital for joint design. This study systematically investigates the effect of oxidation on the microstructure and strength of sintered Cu during high temperature aging. The oxides tend to fill into the interspace of Cu nanoparticles and initially increase both the density and strength of sintered Cu overall. However, particle coarsening behavior occurs later and turns the deformable sintered Cu matrix into a brittle structure. Meanwhile, a novel mechanism of oxidation mediated nano-void formation along the grain boundary (GB) was revealed.

Original language	English
Article number	110713
Journal	CORROSION SCIENCE
Volume	209
Early online date	3 Oct 2022
DOIs	https://doi.org/10.1016/j.corsci.2022.110713
Publication status	Published - Dec 2022

Keywords

sintered copper
NANOPARTICLES
Electronics

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10.1016/j.corsci.2022.110713

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title = "Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging",

abstract = "Sintered Cu interconnection suffers from an oxidation issue in high temperature applications so that understanding the oxidation mechanism is vital for joint design. This study systematically investigates the effect of oxidation on the microstructure and strength of sintered Cu during high temperature aging. The oxides tend to fill into the interspace of Cu nanoparticles and initially increase both the density and strength of sintered Cu overall. However, particle coarsening behavior occurs later and turns the deformable sintered Cu matrix into a brittle structure. Meanwhile, a novel mechanism of oxidation mediated nano-void formation along the grain boundary (GB) was revealed.",

keywords = "sintered copper, NANOPARTICLES, Electronics",

author = "Yang Zuo and Ana Robador and Martin Wickham and Samjid Mannan",

note = "Funding Information: The authors are grateful for the support from China Scholarship Council (CSC) 201806050001. The X-ray diffraction measurements were performed in Department of Chemistry, University of London. Funding Information: The authors are grateful for the support from China Scholarship Council (CSC) 201806050001 . The X-ray diffraction measurements were performed in Department of Chemistry, University of London. Publisher Copyright: {\textcopyright} 2022 Elsevier Ltd",

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doi = "10.1016/j.corsci.2022.110713",

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AU - Zuo, Yang

AU - Robador, Ana

AU - Wickham, Martin

AU - Mannan, Samjid

N1 - Funding Information: The authors are grateful for the support from China Scholarship Council (CSC) 201806050001. The X-ray diffraction measurements were performed in Department of Chemistry, University of London. Funding Information: The authors are grateful for the support from China Scholarship Council (CSC) 201806050001 . The X-ray diffraction measurements were performed in Department of Chemistry, University of London. Publisher Copyright: © 2022 Elsevier Ltd

PY - 2022/12

Y1 - 2022/12

N2 - Sintered Cu interconnection suffers from an oxidation issue in high temperature applications so that understanding the oxidation mechanism is vital for joint design. This study systematically investigates the effect of oxidation on the microstructure and strength of sintered Cu during high temperature aging. The oxides tend to fill into the interspace of Cu nanoparticles and initially increase both the density and strength of sintered Cu overall. However, particle coarsening behavior occurs later and turns the deformable sintered Cu matrix into a brittle structure. Meanwhile, a novel mechanism of oxidation mediated nano-void formation along the grain boundary (GB) was revealed.

AB - Sintered Cu interconnection suffers from an oxidation issue in high temperature applications so that understanding the oxidation mechanism is vital for joint design. This study systematically investigates the effect of oxidation on the microstructure and strength of sintered Cu during high temperature aging. The oxides tend to fill into the interspace of Cu nanoparticles and initially increase both the density and strength of sintered Cu overall. However, particle coarsening behavior occurs later and turns the deformable sintered Cu matrix into a brittle structure. Meanwhile, a novel mechanism of oxidation mediated nano-void formation along the grain boundary (GB) was revealed.

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DO - 10.1016/j.corsci.2022.110713

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VL - 209

JO - CORROSION SCIENCE

JF - CORROSION SCIENCE

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Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging

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